面向TGV衬底的玻璃回流的流动建模

在微机电系统(MEMS)圆片级封装工艺中,为了给制作玻璃通孔(TGV)衬底的玻璃回流工艺提供理论指导意见,提出并建立了一个玻璃回流通用模型,研究槽深、槽宽、温度、时间参数对玻璃回流的影响,并推导出在一定槽宽,槽深,温度下的玻璃在微细槽内流动长度随时间的变化关系.建立玻璃在微细槽内的数学流动模型,运用流体力学的知识,结合微细流体的特征,通过一系列理论分析、推导和简化运算,得出玻璃回流长度随时间等参数的理论变化公式.然后进行玻璃回流实验,当玻璃在恒温T0=800℃、槽宽2b =200 μm、槽深L=1000 μm时,观察并记录玻璃在微细槽内流动长度随时间的变化.将理论回流曲线与实验数据点进行对比,结果表明:实验回流曲线与理论回流曲线趋势一致,且数值基本相符.证明了理论模型及其分析过程的正确性.表明理论分析模型对TGV玻璃回流工艺参数可提供一定的理论指导.

Modeling of glass-reflow facing TGV substrate

In wafer-level vacuum packaging of micro-electro-mechanical system (MEMS),in order to provide guidance for parameters of glass-reflow when making though glass via (TGV) substrate,a general model should be proposed established for glass-reflow in micro-channel to study the influence of channel depth,channel width,flow time,flow temperature on glass-reflow,and deduce how flow depth change with flow time when channel depth,channel width,flow time is sure.A math model of glass reflow is established,theoretical equation of flow depth of glass reflow with time is induced through a series of theoretical analysis,derivation simplified operations,with the knowledge of hydromechanics and feature of micro-channel flow.Then a glass reflow experiment is conducted and flow depth is recorded with the channel depth L of 1000 m,channel width 2b of 200 m and flow temperature T0 of 800 ℃;theoretical curve of glass reflow is compared with the experimental data.Experimental results indicate that experimental data is coincided with theoretically curve of glass reflow.Glass flows in micro-channel of glass-reflow technology by the knowledge of hydromechanics is studied firstly,and theoretically equation of flow depth of glass reflow with time in condition of unsteady flow field is induced,which has some challenges and innovation.These results demonstrate validity of theoretical model of glass reflow and its analysis process.The theoretical analysis model can provide some guidance for technical parameters of TGV glass reflow.