| Pb/Sn凸点的制备 |
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| 引用本文： | 刘豫东,谭智敏,钱志勇,马莒生. Pb/Sn凸点的制备[J]. 电子元件与材料, 2002, 21(9): 4-5,20 |
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| 作者姓名： | 刘豫东 谭智敏 钱志勇 马莒生 |
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| 作者单位： | 1. 清华大学材料科学与工程系,北京,100084
2. 清华大学微电子所,北京,100084 |
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| 基金项目： | 国家自然科学基金资助项目(69836030) |
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| 摘 要： | 介绍了用电镀法制备Pb / Sn凸点的工艺,包括:凸点的设计,圆片的准备,溅射UBM(凸点下金属层),厚膜光刻,电镀Cu柱, Pb / Sn凸点,回流凸点等。结果表明:采用电镀法可以得到球形Pb / Sn凸点,50μm的厚胶工艺是可行的。
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| 关 键 词： | 凸点 电镀法 Pb/Sn焊料 |
| 文章编号： | 1001-2028(2002)09-0004-02 |
Fabrication of Pb/Sn Bumps |
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| LIU Yu-dong,TAN Zhi-min,QIAN Zhi-yong,MA Ju-sheng. Fabrication of Pb/Sn Bumps[J]. Electronic Components & Materials, 2002, 21(9): 4-5,20 |
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| Authors: | LIU Yu-dong TAN Zhi-min QIAN Zhi-yong MA Ju-sheng |
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| Affiliation: | LIU Yu-dong1,TAN Zhi-min2,QIAN Zhi-yong1,MA Ju-sheng1 |
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| Abstract: | Presented is the technology for fabricating Pb/Sn by electric plating, including bump design, disk-preparation, UBM-sputtering, whirl coating photoengraving, Cu stalk plating, Pb/Sn plating, bump-reflowing, etc. The results show that semi-sphere shaped Pb/Sn bumps can be obtained by whirl coating of 50μm. |
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| Keywords: | bumps electric plating Pb/Sn solder |
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