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A penny-shaped crack in a functionally graded piezoelectric strip under thermal loading
Authors:S. Ueda
Affiliation:Department of Mechanical Engineering, Faculty of Engineering, Osaka Institute of Technology, 5-16-1 Omiya, Asahi-ku, Osaka 535-8585, Japan
Abstract:The mixed-mode thermoelectromechanical fracture problem for a functionally graded piezoelectric material (FGPM) strip with a penny-shaped crack is considered. It is assumed that the thermoelectroelastic properties of the strip vary continuously along the thickness of the strip, and that the strip is under thermal loading. The crack faces are supposed to be insulated thermally and electrically. The thermal and electromechanical problems are reduced to singular integral equations and solved numerically. The stress and electric displacement intensity factors are presented for different crack size, crack position and material nonhomogeneity.
Keywords:Electroelasticity   Fracture mechanics   Functionally graded piezoelectric strip   Penny-shaped crack   Thermal loading   Integral transform
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