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Crack redirection with thermal secondary loading
Authors:Anastasia Dobroskok  Larissa Fradkin  Gennady Mishuris
Affiliation:a University of North Dakota, EERC, 15 North 23rd Street, Stop 9018, Grand Forks, ND 58202-9018, USA
b London South Bank University, UK
c Rzeszow University of Technology, Poland
Abstract:In the current paper crack redirection due to a strategic placing of a heat source in the vicinity of a crack tip is studied. Analysis suggests that for PMMA and considered temperature range the only factor responsible for the deviation of crack trajectory is thermal stress. The simulation of crack growth in PMMA under external tension and secondary heat loading shows that a moving heat source in the vicinity of a crack tip can serve as a pointer for the crack trajectory. In highly conductive materials, redirection can be possibly effected with low-power thermal dipoles.
Keywords:Fracture   Redirection   Computational fracture mechanics
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