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A novel cylindrical punch method to characterize interfacial adhesion and residual stress of a thin polymer film |
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| Authors: | Bing-Feng Ju Ming-Fung Wong |
| Affiliation: | a The State Key Lab of Fluid Power Transmission and Control, Zhejiang University, Hangzhou 310027, PR China b Institute of Science and Technology in Medicine, School of Medicine, Keele University, Stoke-on-Trent ST4 7QB, UK c Department of Mechanical and Aerospace Engineering, University of Missouri-Rolla, Rolla, MO 65409-0050, USA |
| Abstract: | Adhesion of a pre-stressed silicone rubber film to a planar graphite surface was investigated by a new cylindrical punch method. A homemade apparatus was constructed to meet force and displacement resolutions of 0.1 μN and 10 nm. When the punch approached the intersurface force range across the punch-film gap, the film jumped into contact at “pull-in”. Upon unloading, once the tensile load reached a threshold, a spontaneous delamination occurred at “pull-off” with a non-zero contact circle. A theoretical model was constructed based a simple energy balance. The new method can be used to characterize an adhesion interface between a pre-stressed free-hanging film and a rigid substrate. |
| Keywords: | Adhesion Contact mechanics Delamination Thin film Surface forces Interface |
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