| 甲磺酸盐电镀Pb-Sn合金工艺研究 |
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| 引用本文： | 卢建红,旷亚非. 甲磺酸盐电镀Pb-Sn合金工艺研究[J]. 电镀与精饰, 2007, 29(2): 20-22 |
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| 作者姓名： | 卢建红 旷亚非 |
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| 作者单位： | 1. 湖南大学,化学化工学院,湖南,长沙,410082;中国人民解放军第5713厂,湖北,襄樊,441002
2. 湖南大学,化学化工学院,湖南,长沙,410082 |
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| 摘 要： | 研究了甲磺酸电镀Pb-Sn合金的电解液组成,讨论了主盐、游离酸、稳定剂的质量浓度以及阴极电流密度对Pb-Sn合金镀层中Sn含量的影响。采用Hull槽试验方法确定了甲磺酸电沉积Pb-Sn合金镀层的阴极电流密度范围。根据研究结果确定了甲磺酸体系电镀Pb-Sn合金润滑镀层的工艺规范。
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| 关 键 词： | 甲磺酸 电镀 铅-锡合金 润滑镀层 |
| 文章编号： | 1001-3849（2007）02-0020-03 |
| 收稿时间： | 2006-06-14 |
| 修稿时间： | 2006-06-14 |
Study on Pb-Sn Alloy Electroplating in Methylsulfonate Bath |
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| LU Jian-hong,KUANG Ya-fei. Study on Pb-Sn Alloy Electroplating in Methylsulfonate Bath[J]. Plating & Finishing, 2007, 29(2): 20-22 |
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| Authors: | LU Jian-hong KUANG Ya-fei |
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| Abstract: | Methylsulfonate bath composition for Pb-Sn alloy electroplating was studied.Concentrations of main salts,free acid and stabilizers and cathodic current density on the Sn content in the Pb-Sn alloy coating were discussed.Range of cathodic current density suitable for electroplating PbSn alloy coating in the methylsulfonate bath was determined with Hull cell test. And the technological standard for Pb-Sn alloy lubrication coating electroplating in methlsulfonate bath was finally established in accordance with the results of this study. |
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| Keywords: | methylsulfonic acid electroplating lead-tin alloy lubrication coating |
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