| 无铅焊接工艺中常见缺陷及防止措施 |
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| 引用本文： | 史建卫.无铅焊接工艺中常见缺陷及防止措施[J].电子工艺技术,2008,29(1):53-56. |
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| 作者姓名： | 史建卫 |
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| 作者单位： | 日东电子科技(深圳)有限公司,广东,深圳,518103 |
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| 摘 要： | 无铅化电子组装中,由于原材料的变化带来一系列工艺的变化,随之产生许多新的焊接缺陷.针对表面裂纹、表面发暗及二次回流等缺陷进行了机理分析,并给出了相应的解决措施.
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| 关 键 词： | 无铅 焊点 表面裂纹 表面发暗 二次回流 |
| 文章编号： | 1001-3474（2008）01-0052-04 |
| 收稿时间： | 2007-11-10 |
| 修稿时间： | 2007年11月10 |
Solder Defects and Solutions in Lead-free Soldering Technology |
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| SHI Jian-wei.Solder Defects and Solutions in Lead-free Soldering Technology[J].Electronics Process Technology,2008,29(1):53-56. |
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| Authors: | SHI Jian-wei |
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| Affiliation: | SHI Jian-wei(Sun East Electronic Technology Company Lt.d,Shenzhen 518103,China) |
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| Abstract: | Changes of material bring a series of process problems in lead - free electronic assembly with occurrence of new solder defects. Analyze causes and give solution of solder defects for surface crack, coarse surface finish of solder joint and the 2nd reflow issue. |
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| Keywords: | Lead - free Solder joint Surface crack Coarse surface finish The 2nd reflow |
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