真空玻璃封接接头残余应力的影响因素分析

采用正交设计和有限元模拟的方法研究了真空玻璃的钎焊温度、保温时间、钎料厚度和施加压力等工艺参数对真空玻璃封接接头残余应力的影响,并分析不同钎焊工艺对真空玻璃封接接头剪切强度的影响,确定了最优水平组合。结果表明:钎料的厚度对接头残余应力的影响最为显著,施加压力对接头残余应力的影响较为显著,钎焊温度和保温时间的影响较小;钎焊温度为275℃,保温时间为20 min时,接头剪切强度最高。最优的水平组合为钎焊温度275℃,保温时间20 min,钎料厚度为0.3 mm,施加压力为8.56 N。优化的参数设计能够减小接头的残余应力,有利于提高接头的强度。

Residual Stress at Soldered Glass Joint:A Simulation and Experimental Study

The soldering of two pieces of Ag-coated vacuum glass, an energy-saving window/door material, was empirically approximated, mathematically modeled, numerically simulated in finite element method with ANSYS and experimentally evaluated.The influence of the soldering conditions, including the soldering temperature, holding time, solder thickness and pressure, on the shear strength and residual stress was investigated in 4-factor 4-level orthogonal test and shear strength measurement.The results show that the filler thickness and pressure had a major impact and the soldering temperature and holding-time had a minor impact.The orthogonal and shear strength tests results were in good agreement.The optimized soldering conditions included: a soldering temperature of 275℃,a holding time of 20 min, a solder thickness of 0.3 mm and a pressure of 8.56 N.Soldered under the optimized conditions, the soldered joint had the lowest residual stress and the strongest shear strength.