Application of electron beam lithography to study microcreep deformation and grain boundary sliding

Electron beam lithography has been employed to study microcreep deformation and grain boundary sliding in pure copper. Fine electron-sensitive microgrids of an alloy of palladium and gold were developed on the surface of rectangular specimens. Interrupted creep tests were carried out at 723 K at two stress levels in an argon atmosphere. Creep strain and grain boundary sliding were determined by forming Moire fringes in a scanning electron microscope as well as from the displacement of the grid lines. Local distribution of creep strain inside the grains was found to be non-uniform. Grain boundary sliding exhibited a wavy behaviour.