Application of electron beam lithography to study microcreep deformation and grain boundary sliding |
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Authors: | S KISHIMOTO N SHINYA M. D MATHEW |
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Affiliation: | (1) National Research Institute for Metals, 1-2-1, Sengen, Tsukuba Ibaraki, 305, Japan;(2) Indira Gandhi Centre for Atomic Research, Kalpakkam, 603 102, India |
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Abstract: | Electron beam lithography has been employed to study microcreep deformation and grain boundary sliding in pure copper. Fine electron-sensitive microgrids of an alloy of palladium and gold were developed on the surface of rectangular specimens. Interrupted creep tests were carried out at 723 K at two stress levels in an argon atmosphere. Creep strain and grain boundary sliding were determined by forming Moire fringes in a scanning electron microscope as well as from the displacement of the grid lines. Local distribution of creep strain inside the grains was found to be non-uniform. Grain boundary sliding exhibited a wavy behaviour. |
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