Investigation of hydrophobic porous electrodes. II. Pseudocapacitance changes during underpotential copper deposition |
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Authors: | J McHardy |
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Affiliation: | (1) EIC Corporation, 55 Chapel Street, 02158 Newton, Mass., USA |
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Abstract: | Differential capacitance measurements in 96%o-phosphoric acid at 160° C have been used to follow the underpotential deposition of copper on supported platinum in a porous electrode. At a potential in the range 0·2–0·3 V versus RHE the capacitance,C, increased as copper deposition proceeded and a plot ofC versust
1/2 was linear during a substantial part of the deposition process. The slope dC/dt
1/2 was proportional to the copper concentration in solution, suggesting that the Cu/Cu2+ pseudocapacitance reflected the quantity of copper deposited and that copper deposition was diffusion controlled. The effective diffusion coefficient estimated from the results was 10–7 cm2 s–1 — some 40 times smaller than the copper ion diffusion coefficient measured separately. At potentials of 0·4 V and above, capacitance measurements could not be used to follow copper deposition because the Cu/Cu2+ pseudocapacitance decayed with time. |
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