| 纯铜动态再结晶的三维元胞自动机模拟 |
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| 引用本文： | 柳文波,张弛,杨志刚,许峰云. 纯铜动态再结晶的三维元胞自动机模拟[J]. 材料热处理学报, 2009, 30(6): 196-200,205 |
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| 作者姓名： | 柳文波 张弛 杨志刚 许峰云 |
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| 作者单位： | 清华大学材料科学与工程系先进材料教育部重点实验室,北京,100084;清华大学材料科学与工程系先进材料教育部重点实验室,北京,100084;清华大学材料科学与工程系先进材料教育部重点实验室,北京,100084;清华大学材料科学与工程系先进材料教育部重点实验室,北京,100084 |
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| 基金项目： | 国家自然科学基金，教育部留学回国人员科研启动基金 |
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| 摘 要： | 用三维元胞自动机法(CA法)模拟纯铜在400℃以0.0005s~(-1)的应变率发生动态再结晶(DRX)的过程.给出了母相和再结晶晶粒的平均位错密度随着应变量的变化规律;根据平均位错密度的变化研究了纯铜动态再结晶中形核、长大、动态回复和加工硬化等过程.模拟了纯铜动态再结晶过程中的应力.应变曲线及平均晶粒尺寸的变化规律,模拟结果与文献中的试验结果吻合较好.
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| 关 键 词： | 位错密度 三维 动态再结晶 元胞自动机 |
Modeling for dynamic recrystallization of pure copper with 3-dimensional cellular automaton method |
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| LIU Wen-bo,ZHANG Chi,YANG Zhi-gang,XU Feng-yun. Modeling for dynamic recrystallization of pure copper with 3-dimensional cellular automaton method[J]. Transactions of Materials and Heat Treatment, 2009, 30(6): 196-200,205 |
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| Authors: | LIU Wen-bo ZHANG Chi YANG Zhi-gang XU Feng-yun |
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| Abstract: | A modeling of 3-dimensional cellular automaton (CA) method was developed to simulate the dynamic recrystallization(DRX) of pure copper at 400℃ with constant strain rate 0.0005s~(-1) . Mean dislocation density was used to describe the process of nucleation, growth, work harding and dynamic recovery during dynamic recrystallization. The flow stress was calculated by the mean dislocation. Stress-strain curves and changes of the average grain size during DRX of pure copper were simulated. Simulated results agree well with the experimental result in literature. |
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| Keywords: | dislocation density 3 dimension dynamic recrystallization cellular automaton |
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