| Cu厚膜微带制作及其性能研究 |
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| 引用本文： | 戴晏平 侯国栋. Cu厚膜微带制作及其性能研究[J]. 电讯技术, 1991, 31(4): 12-18 |
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| 作者姓名： | 戴晏平 侯国栋 |
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| 作者单位： | 机电部第十研究所 研究生(戴宴平)，所电部第十研究所 研究员(侯国栋) |
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| 摘 要： | 本文进一步研究了新型的在大气气氛中烧结的贱金属(Cu)多层导电浆料,并采用干膜反光刻抛光微带工艺,将浆料推广应用到较高频率范围的微波集成电路。文中介绍了制作低通滤波器和混频器的实例。
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| 关 键 词： | 微波集成电路 厚膜 微带 铜 制作 |
Development of copper thick film microstrip |
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| Graduate Student Dai Yanping,Research Fellow Hou Guodong The Tenth Institude of Ministry of Machine-Building and Electronics Industry. Development of copper thick film microstrip[J]. Telecommunication Engineering, 1991, 31(4): 12-18 |
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| Authors: | Graduate Student Dai Yanping Research Fellow Hou Guodong The Tenth Institude of Ministry of Machine-Building Electronics Industry |
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| Affiliation: | Graduate Student Dai Yanping;Research Fellow Hou Guodong The Tenth Institude of Ministry of Machine-Building and Electronics Industry |
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| Abstract: | This paper introduces a new base metal Cu multilayer conductor paste firingin the air. The behavious of the paste is raised largely by means of reducing copperpowder diameter and improving firing technology. We have used a dry film reversephotoetching polish technology, and thus Cu multilayer conductor paste can be appliedto higher frequency microwave integrated circuit. praetical examples making low passfilter and mixer are given in the paper. |
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| Keywords: | Microwave Integrated Circuit Microstrip Thick Film Hybrid Technology |
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