| 聚合物胶粘剂粘片FMEA研究 |
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| 引用本文： | 刘庆川,刘笛,关亚男. 聚合物胶粘剂粘片FMEA研究[J]. 微处理机, 2012, 33(4): 28-31 |
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| 作者姓名： | 刘庆川 刘笛 关亚男 |
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| 作者单位： | 中国电子科技集团公司第四十七研究所,沈阳,110032 |
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| 摘 要： | 芯片的粘接质量直接决定了集成电路产品的可靠性和使用寿命,目前主流的芯片粘接工艺为聚合物粘接工艺。使用该工艺的产品覆盖了军民品各领域,但是随着微电子行业的迅速发展,以及产品使用环境的日益恶化,对于聚合物粘接的质量可靠性要求也变得日益严格,因此对聚合物粘接控制工艺开展研究,有助于聚合物粘接质量的提升。通过对聚合物胶粘剂粘片工序引入FMEA方法进了研究探讨,对于实际生产及芯片粘接能力的提升有着重要的指导意义。
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| 关 键 词： | 聚合物粘接 FMEA方法 聚合物胶粘剂 |
The FMEA Study for Polymer Adhesive Die Bonding |
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| LIU Qing-chuan , LIU Di , GUAN Ya-nan. The FMEA Study for Polymer Adhesive Die Bonding[J]. Microprocessors, 2012, 33(4): 28-31 |
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| Authors: | LIU Qing-chuan LIU Di GUAN Ya-nan |
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| Affiliation: | (The 47th Research Institute of China Electronics Technology Group Corporation,Shenyang 110032,China) |
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| Abstract: | Integrated circuit product reliability and life depend on die bonding quality.The current mainstream die bonding process is polymer bonding process.The products used this technology covering all areas of military and civilian goods.With the rapid development of the microelectronics industry,environment is deteriorating.Quality and reliability of polymer bonding has become increasingly stringent.Research of polymer bonding process will improve the polymer stick then quality.In this paper,FMEA is studied in polymer adhesive process,improved the level of chip bonding and important guiding. |
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| Keywords: | Polymer die bonding FMEA Polymer adhesive |
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