厚铜板盲孔缺胶改善探讨

随着模块电源的不断开发与发展,厚铜印制板的生产越来越受到业界的关注和重视。由于表铜较厚,在钻孔/层压/蚀刻/阻焊等制程均有区别于普通PCB加工的工艺控制和难点,且随着布线密度的增加,厚铜板采用盲埋孔设计工艺的比例也越来越高,这进一步加大了工艺加工难度。文章就厚铜板盲孔缺胶问题展开了一系列分析和探讨,并通过工艺优化进行了有效改善,大大提高了生产品质及一次良品率。

Discussion about the PCB with thick copper and lack of plastic blind hole

With the development of module power,the PCB with thick copper will take more and more attention by the circuit board industry,as the thick copper,this production process of PCB is different from normal in drilling,laminating,etching and solder mask printing.And with the wiring density,the PCB with thick copper is always designed by blind hole,the process becomes more difficult.The article analyzed and discussed about the problem of the lack of plastic blind hole,through improving and optimizing the process...