| 高厚径比值密集盘内孔树脂塞孔研究 |
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| 引用本文： | 黄云钟,李金鸿.高厚径比值密集盘内孔树脂塞孔研究[J].印制电路信息,2011(4):72-75. |
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| 作者姓名： | 黄云钟 李金鸿 |
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| 作者单位： | 珠海方正科技印刷电路板发展有限公司,广东,珠海,519170 |
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| 摘 要： | 设计DOE试验,对高厚径比值密集盘内孔(AR≥1 0,孔心距≤0.80mm)树脂塞孔进行了研究,通过分析确定了塞孔角度是影响树脂塞满度的主要因素,并找到了高厚径比值密集盘内孔树脂塞孔的最佳工艺参数。
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| 关 键 词： | 高厚径比值 密集盘内孔 树脂塞孔 |
Study on resin plugging hole of dense VIP with high aspect ratio |
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| Huang Yun-zhong,LI Jin-hong.Study on resin plugging hole of dense VIP with high aspect ratio[J].Printed Circuit Information,2011(4):72-75. |
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| Authors: | Huang Yun-zhong LI Jin-hong |
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| Affiliation: | Huang Yun-zhong LI Jin-hong |
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| Abstract: | This paper studied on resin plugging hole of dense VIP with high aspect ratio（AR≥10,pitch≤0.80 mm） through DOE.Analysis showed that the angle of plugging hole mainly affected the resin satiation of the hole.Finally,optimum parameters were found out to plug dense VIP with high aspect ratio. |
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| Keywords: | high AR dense VIP resin plugging hole |
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