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优异耐漏电起痕特性的涂树脂铜箔的研究
引用本文:汪青,刘东亮.优异耐漏电起痕特性的涂树脂铜箔的研究[J].印制电路信息,2011(4):29-31.
作者姓名:汪青  刘东亮
作者单位:广东生益科技股份有限公司,广东,东莞,523039
摘    要:文章讨论了通过涂树脂铜箔(RCC)来制备高相比漏电起痕指数(CTI)覆铜板的方法,并系统研究了影响CTI值的各种因素,在实验室开发出了综合性能较好的高CTI RCC.

关 键 词:相比漏电起痕指数(CTI)  涂树脂铜箔(RCC)  覆铜板

Study on the resin coated copper of excellent tracking resistibility
WANG Qing,LIU Dong-liang.Study on the resin coated copper of excellent tracking resistibility[J].Printed Circuit Information,2011(4):29-31.
Authors:WANG Qing  LIU Dong-liang
Affiliation:WANG Qing LIU Dong-liang
Abstract:The method of making copper clad laminate with high CTI by resin coated copper was discussed. The factors that influence CTI were researched systematically.High CTI RCC formula with well comprehensive properties was developed in the lab.
Keywords:comparative tracking index(CTI)  resin coated copper(RCC)  copper clad laminate(CCL)  
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