| 孔到线小间距、高厚径比PCB设计制作探讨 |
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| 引用本文： | 谢长文,张小强,肖湘辉.孔到线小间距、高厚径比PCB设计制作探讨[J].印制电路信息,2011(4):195-199. |
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| 作者姓名： | 谢长文 张小强 肖湘辉 |
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| 作者单位： | 深圳市牧泰莱电路技术有限公司,广东,深圳,518103 |
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| 摘 要： | 本文介绍了一种孔到线小间距、超高厚径比的PCB设计制作方法,此方法通过层压结构设计和对位精度设计,使厚径比能满足大部分厂家的工艺能力,同时孔到线的难点也在关键工序得以掌控。
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| 关 键 词： | 高厚径比 结构设计 对位精度 |
Discuss design and processing method of hole to Line small and high thick diameter ratio |
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| XIE Chang-wen,ZHANG Xiao-qiang,XIAO Xiang-hui.Discuss design and processing method of hole to Line small and high thick diameter ratio[J].Printed Circuit Information,2011(4):195-199. |
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| Authors: | XIE Chang-wen ZHANG Xiao-qiang XIAO Xiang-hui |
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| Affiliation: | XIE Chang-wen ZHANG Xiao-qiang XIAO Xiang-hui |
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| Abstract: | This article introduced one kind of hole to line small,super-elevation thick diameter.Compared to the PCB design manufacture method,this method is through the lamination structural design and to the position precision design,which enables the thick diameter compared to satisfy the majority of factories craft ability,and simultaneously overcomes hole to line the difficulty and essential working procedure can be controlled. |
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| Keywords: | High thick diameter ratio hole to Line small Structural design To position precision |
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