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Indium thermal interface material microstructure as a function of thermal history and bonding metallization |
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| Authors: | McClure Peter Wang Yujia |
| Affiliation: | 1.Universal Instruments’ Advanced Process Laboratory, Conklin, NY, 13748, USA ;2.Materials Science and Engineering, Cornell University, Ithaca, NY, 14850, USA ; |
| Abstract: | Journal of Materials Science: Materials in Electronics - Indium has gained attention as a thermal interface material (TIM), in high-power electronics, due to its high thermal conductivity and... |
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