高阶表面结构刚挠结合印制板制作技术

高阶表面结构刚挠结合印制电路板集合了混压设计,不对称设计等特点,且挠性板在外层,导致开窗处高度差较大,这一特点给制作增添了较大难度.本文选取此类典型刚挠结合板产品,分享部分关键制作技术.

High step surface structure Rigid-Flex PCB production technology

High step surface structure rigid-flex PCB combines the characteristics of a mixed pressure design and an asymmetrical design.Especially the flexible plate is on the outer layer,resulting in a large difference in height at the window opening.This feature adds great difficulty to the production.This paper selects such typical rigid-flex board products and shares some key production techniques.