Contact resistance measurement of bonded copper interconnects for three-dimensional integration technology |
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Authors: | Chen K.N. Fan A. Tan C.S. Reif R. |
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Affiliation: | Microsystems Technol. Labs., Massachusetts Inst. of Technol., Cambridge, MA, USA; |
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Abstract: | A novel test structure for contact resistance measurement of bonded copper interconnects in three-dimensional integration technology is proposed and fabricated. This test structure requires a simple fabrication process and eliminates the possibility of measurement errors due to misalignment during bonding. Specific contact resistances of bonding interfaces with different interconnect sizes of approximately 10/sup -8/ /spl Omega/-cm/sup 2/ are measured. A reduction in specific contact resistance is obtained by longer anneal time. The specific contact resistance of bonded interconnects with longer anneal time does not change with interconnect sizes. |
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