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| 气孔缺陷位置对SMT焊点热疲劳寿命影响的数值分析 | |
| 引用本文： | 杨敏,邹增大,王春青,王育福,李立英.气孔缺陷位置对SMT焊点热疲劳寿命影响的数值分析[J].中国机械工程,2003,14(8):708-711. |
| 作者姓名： | 杨敏 邹增大 王春青 王育福 李立英 |
| 作者单位： | 1. 山东大学,济南市,250061 2. 山东大学材料科学与工程学院 3. 哈尔滨工业大学,哈尔滨市,150001 |
| 基金项目： | 现代焊接生产技术国家重点实验室开放课题资助项目 |
| 摘 要： | 通过用统一的粘塑性本构方程描述SMT焊点的力学行为，对气孔缺陷在SMT焊点中不同位置的情况建立二维有限元分析模型，并采用有限元方法分析了气孔位置对SMT焊点疲劳寿命的影响。分析发现，与无缺陷焊点相比，气孔使焊点中应力应变分布发生了改变，使焊点疲劳寿命缩短；焊角、焊趾和焊点中部位置的气孔对焊点中的应力应变和焊点的疲劳寿命影响较小，而焊点根部气孔的影响则显著。 |
| 关 键 词： | 气孔 SMT焊点 粘塑性 疲劳寿命 |
| 文章编号： | 1004-132X(2003)08-0708-04 |
Numerical Analysis for Effect of Gas Hole Location on SMT Solder Joint Thermal Fatigue Life |
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| Yang Min.Numerical Analysis for Effect of Gas Hole Location on SMT Solder Joint Thermal Fatigue Life[J].China Mechanical Engineering,2003,14(8):708-711. | |
| Authors: | Yang Min |
| Abstract: | The unified viscoplastic constitutive model has been used to describe the mechanical behavior of SMT solder joint in this paper, and two dimension finite element analysis models of solder joint with gas hole of different location have also been established. The effect of gas hole location on SMT solder joint fatigue life has been analyzed by finite element method . Compared to the solder joint without hole, it was found that the hole will change the stress/strain distribution of the solder joint around the hole and will shorten the fatigue life of the solder joint. The effects of the hole located at solder joint top, solder joint toe and the center of solder joint on solder joint fatigue life are very small, but the effect of solder joint root on solder joint fatigue life is the greatest. |
| Keywords: | gas hole SMT solder joint viscoplastic fatigue life |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ | |