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小纵横比光电器件发射端耦合工艺研究及优化
引用本文:江秋月,仲顺顺,周雄锋,吴国栋,马著,孙翔.小纵横比光电器件发射端耦合工艺研究及优化[J].激光技术,2020,44(5):546-552.
作者姓名:江秋月  仲顺顺  周雄锋  吴国栋  马著  孙翔
作者单位:1.中南大学 机电工程学院,长沙 410083
基金项目:国家重点研发计划资助项目
摘    要:为了系统研究影响耦合效率的因素,采用仿真和实验的方法建立了半导体激光器与单模光纤的耦合模型,并搭建自动耦合平台,进行了理论分析和实验验证,得到了模型的耦合效率与各个方向位移敏感度的关系以及实际耦合过程中耦合效率与各个方向容忍度的关系。结果表明,耦合效率对水平方向位移最为敏感,其后依次是角度旋转和纵向位移; 仿真与实验最大耦合效率分别为64.29%与51.46%,误差在合理范围之内,结果具有较高可信度。这一结果对实际光电器件封装耦合效率的提高是有帮助的。

关 键 词:光通信    容忍度    仿真优化    耦合模型    半导体激光器    耦合效率
收稿时间:2019-10-24

Research and optimization of coupling of small aspect ratio optoelectronic devices
Abstract:In order to systematically research the factors affecting coupling efficiency, the coupling model of semiconductor laser and single-mode fiber was established and an automatic coupling platform was built by means of simulation and experiment. Theoretical analysis and experimental verification were carried out, and the relationship between coupling efficiency of the model and displacement sensitivity of each direction and the relationship between coupling efficiency and tolerance of each direction in the actual coupling process were obtained. The results show that, coupling efficiency is most sensitive to horizontal displacement, followed by angular rotation and longitudinal displacement. The maximum coupling efficiency of simulation and experiment is 64.29% and 51.46% respectively. The error of simulation and experiment is within a reasonable range, thus the results are highly credible. The results are helpful to improve the packaging coupling efficiency of practical photoelectric devices.
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