Tensile deformation behavior of nano-sized Mo particles reinforced SnAgCu solders |
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Authors: | B.S.S. Chandra Rao K. Mohan KumarV. Kripesh K.Y. Zeng |
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Affiliation: | a Department of Mechanical Engineering, National University of Singapore, 9 Engineering Drive 1, Singapore 117576, Singapore b Institute of Microelectronics, Agency for Science, Technology and Research (A*STAR), 11 Science Park Road, Science Park II, Singapore 117685, Singapore |
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Abstract: | In this work, tensile deformation of Sn-3.8Ag-0.7Cu (SAC387) solder and composite of SAC387 reinforced with nano-sized Mo particles have been studied with strain rates from 10−5 to 10−1 s−1 and temperatures of 25, 75 and 125 °C. It is found that the yield strength (σY.S) and strain hardening exponent (n) are increased with the strain rate, but the n values decrease with increasing temperatures. The n values of the composite solder are also increased with the percentage of the Mo nano-particles (up to 1 wt.%) and thereafter decrease with further increasing of the Mo particle. The strain rate dependence of the Hollomon parameters is found to be stronger at higher temperatures for SAC387 solder, but it is weaker for the composite solders. Empirical equations for σY.S and Hollomon parameters with strain rate and temperatures have been found for both SAC387 and composite solders. Finally, the fracture surfaces of the solders are examined. |
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Keywords: | SnAgCu solder Composite solders Yield strength Hollomon parameters Strain rate Temperature |
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