| 固化残余应力对倒装焊器件热–机械可靠性的影响 |
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| 引用本文： | 刘士龙,秦连城,杨道国,郝秀云.固化残余应力对倒装焊器件热–机械可靠性的影响[J].电子元件与材料,2003,22(2):44-47,49. |
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| 作者姓名： | 刘士龙 秦连城 杨道国 郝秀云 |
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| 作者单位： | 桂林电子工业学院机电与交通工程系,广西,桂林,541004 |
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| 基金项目： | 国家自然科学基金，60166001， |
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| 摘 要： | 采用底充胶的与固化过程相关的粘弹性力学模型,通过有限元仿真的方法,模拟了底充胶的整个固化过程,计算出了热循环加载下硅片、底充胶/硅片界面、底充胶内部的应力分布及其幅值大小.结果表明:底充胶的固化过程及由此产生的固化残余应力不但使得硅片中的最大垂直开裂应力位置偏离中心线达1.6 mm之多,而且还劣化了热循环加载下底充胶中应力幅值约6.25%.最后得出了固化残余应力对倒装焊器件热–机械可靠性的影响是不可忽略的结论.
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| 关 键 词： | 倒装焊 底充胶 有限元仿真 固化 残余应力 热循环 |
| 文章编号： | 1001-2028(2003)02-0044-04 |
| 修稿时间： | 2002年9月19日 |
Flip-Chip Assembly in Thermal Cycle: Effects of Residual Stress Due to Cure on the Thermo-mechanical Reliability |
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| LIU Shi-long,QIN Lian-cheng,YANG Dao-guo,HAO Xiu-yun.Flip-Chip Assembly in Thermal Cycle: Effects of Residual Stress Due to Cure on the Thermo-mechanical Reliability[J].Electronic Components & Materials,2003,22(2):44-47,49. |
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| Authors: | LIU Shi-long QIN Lian-cheng YANG Dao-guo HAO Xiu-yun |
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| Abstract: | Through modeling cure-dependent viscoelastic behavior of underfill epoxy, the curing process was simulated by FEA software and the stress distribution and magnitude in silicon die, underfill /silicon die interface and underfill were calculated in flip chip assembly. The results indicate that the residual stresses caused by cure have made an offset of 1.6mm of the maximum vertical die crack stresses, and an increase in the stress magnitude in underfill by about 6.5%. The influence of the residual stress cannot be neglected. |
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| Keywords: | flip-chip assembly underfill FEA simulation cure residual stress thermal cycle |
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