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铝基复合钎料钎焊机理
引用本文:刘安华,路文江,俞伟元,张凌云,曹金山. 铝基复合钎料钎焊机理[J]. 新技术新工艺, 2009, 0(12): 113-115
作者姓名:刘安华  路文江  俞伟元  张凌云  曹金山
作者单位:兰州理工大学,甘肃省有色金属新材料国家重点实验室,甘肃,兰州,730050
摘    要:采用Cu/Al-Si/Cu式复合钎料,在不同温度下钎焊铝及其合金,通过钎焊接头金相图片和电子探针对焊缝线扫描,分析接头反应结合情况,研究钎焊接头在此条件下共晶反应特征以及铜和硅的扩散特点。研究表明,铜的加入能够显著降低钎焊温度,从而有效保护钎焊母材。不同的钎焊温度,钎焊接头表现出不同的共晶反应,且共晶液相的产生极大地促进了铜和硅的扩散能力。首先内侧发生Al-Si-Cu三元共晶反应,随着钎焊温度超过548℃,铝和铜之间发生二元共晶反应,接头反应能够充分进行,得到较为理想的接触反应区。

关 键 词:复合钎料  接触反应  钎焊

Brazing Principle of Aluminum Matrix Composite Solder
Affiliation:LIU Anhua, LU Wenjiang, YU Weiyuan, ZHANG Lingyun (State Key Laboratory of Advanced Non ferrous Metal Materials, Lanzhou University of Technology, Lanzhou 730050, China)
Abstract:In this paper, the aluminum and its alloys were brazed at different temperatures by Cu / Al-Si / Cu composite solder. And then the strength of the joints was analyzed through metallograpic picture and electron probe scan picture of weld line. After that the eutectic reaction characteristics and the proliferation features for copper and silicon were studied. The studies show that the addition of copper can lower brazing temperature significantly, by this can protect the brazing base materials effectively. As the brazing temperature is different, the eutectic reaction on brazing joints is different, and the emergence of eutectic liquid greatly enhances the proliferation ability of copper and silicon. First, ternary eutectic reaction of Al--Si--Cu was happened inside, as the brazing temperature exceeds 548 ℃, aluminum and copper appear the binary eutectic reaction, joint reaction can reacted fully, and can get an ideal reaction zone.
Keywords:Composite solder  Contact reaction  Brazing
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