Morphological stability of copper-silver multilayer thin films at elevated temperatures |
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Authors: | Email author" target="_blank">H?Ludtke?KnoedlerEmail author G?E?Lucas C?G?Levi |
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Affiliation: | (1) Department of Chemical Engineering, University of California, Santa Barbara;(2) Skyworks Solutions Inc., 91320 Newbury Park, CA;(3) Department of Materials Engineering, the University of California, 91306 Santa Barbara, CA;(4) Department of Mechanical Engineering, the University of California, 91306 Santa Barbara, CA |
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Abstract: | The kinetics of breakdown of Cu-Ag polycrystalline multilayers during aging at elevated temperatures was investigated. Microlaminates
with Cu:Ag layer thicknesses of 2:2, 1:4, 4:1, and 4:0.1 μm were aged for 10 minutes to 192 hours (t), at temperatures ranging from 700 to 900 K. The asdeposited microlaminates had a fine-grained columnar microstructure with
well-defined interfaces. Upon annealing, the morphology evolved over three time regimes. In the first regime, the grains in
each phase grew quickly to an apparent terminal size, which depended on both the layer thickness and annealing temperature.
Next, grooves formed at the intersections of grain boundaries and layer interfaces and grew with a t
0.25 dependence. The groove growth appeared to be independent of layer thickness and was approximately equal in Cu and Ag. The
microlaminates started to break down in the third regime, as grain-boundary grooves on opposite sides of a layer bridged its
thickness. Models for grain growth and grooving in thin films were modified for multilayer microlaminates and were shown to
fit the experimental data reasonably well. This suggests that the terminal grain size is reached when groove drag overcomes
the capillary forces driving grain growth, and that grooving kinetics are dominated by interfacial diffusion. |
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