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Curved drilling via inner hole laser reflection
Affiliation:1. State Key Laboratory of Precision Spectroscopy, School of Physics and Materials Science, East China Normal University, Shanghai 200062, China;2. XXL—The Extreme Optoelectromechanics Laboratory, School of Physics and Materials Science, East China Normal University, Shanghai 200241, China;3. State Key Laboratory of High Field Laser Physics, Shanghai Institute of Optics and Fine Mechanics, Chinese Academy of Sciences, Shanghai 201800, China;4. Collaborative Innovation Center of Extreme Optics, Shanxi University, Taiyuan, Shanxi 030006, China;1. Department of Laser and Electron Beam Applications, Korea Institute of Machinery & Materials (KIMM), Daejeon, South Korea;2. Department of Nano-Mechatronics, Korea University of Science and Technology (UST), Daejeon, South Korea;3. Department of Material Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, South Korea
Abstract:In this paper, we describe curved hole drilling via the reflection of a laser beam off the sidewall of the drilled hole. A slightly offset laser beam forms a tilted surface at the bottom of the hole, controlling the angle of curvature. An ultraviolet laser beam operating at a wavelength of 266 nm was used. To visualize the hole formation process, borosilicate glass was used as the laser workpiece. This method was able to drill a curved hole with an average angle of ∼3° with curvature beginning at a depth of 400–600 μm. A curved hole with a diameter of <50 μm was achieved. A branched hole was also demonstrated by using the reflection of the tilted sidewall. The curved hole formation process was recorded with a high speed camera. Once the ablated sidewall reached a certain depth, drilling ceased as the laser energy fell below the ablation threshold. Ultimately, judicious selection of an appropriate laser fluence and sidewall angle allow the formation of curved holes.
Keywords:Curved hole  Laser drilling  Borosilicate glass  High-aspect-ratio hole
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