| 半光亮镍镀层涂覆铅锡焊料工艺生产实践 |
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| 引用本文： | 肖云顺.半光亮镍镀层涂覆铅锡焊料工艺生产实践[J].印制电路信息,2005(12):40-42. |
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| 作者姓名： | 肖云顺 |
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| 作者单位： | 株洲电力机车研究所印制电路板厂,412000 |
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| 摘 要： | 主要探讨了半光亮镍镀层涂覆铅锡焊料工艺在印制电路板中的生产实践应用。就工艺流程控制要点及生产方案准备进行了有益的探究。
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| 关 键 词： | 半光亮镍镀层 铅锡焊料涂覆 生产实践 |
Production Practice of Tin-lead Solder Coating over Semibright Nickel Plating Technics |
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| Xiao Yunshun.Production Practice of Tin-lead Solder Coating over Semibright Nickel Plating Technics[J].Printed Circuit Information,2005(12):40-42. |
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| Authors: | Xiao Yunshun |
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| Affiliation: | Xiao Yunshun |
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| Abstract: | In the paper, production practice of the tin-lead solder coating over semibright nickel plating technics is introduced. Investigating into main points of process flow control and production planning. |
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| Keywords: | semibright nickel plating tin-lead solder coating production practice |
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