| 电磁激励微谐振式传感器的设计与制作 |
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| 引用本文： | 高振宁,陈德勇,王军波,毋正伟.电磁激励微谐振式传感器的设计与制作[J].微纳电子技术,2008,45(10). |
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| 作者姓名： | 高振宁 陈德勇 王军波 毋正伟 |
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| 作者单位： | 1. 中国科学院,电子学研究所,传感技术联合国家重点实验室,北京,100190;中国科学院,研究生院,北京,100039
2. 中国科学院,电子学研究所,传感技术联合国家重点实验室,北京,100190 |
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| 摘 要： | 利用微电子机械加工技术成功研制出电磁激励-电磁拾振硅谐振梁式压力传感器。传感器以"H"型双端固支梁为谐振器,采用差分检测结构。工艺制作采用体硅加工工艺,并且采用一种减小封装应力的结构完成压力传感器的真空密封及封装。利用锁相环微弱信号检测技术建立的开环频率特性测试系统及闭环自激测试系统测试了传感器的频率、压力特性等相关技术指标。谐振器在空气中的品质因素Q值大于1200;在真空中的Q值大于7000。压力满量程刻度为0～120kPa。差分输出的结果优于单个谐振梁的输出结果,差分输出结果的线性相关系数为0.9999,灵敏度为225.77Hz/kPa。
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| 关 键 词： | 微机电系统 谐振式压力传感器 电磁激励电磁拾振 差分检测 体硅微加工工艺 |
Design and Fabrication of a Miniature Resonant Pressure Sensor Based on MEMS Technology |
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| Gao Zhenning,Chen Deyong,Wang Junbo,Wu Zhengwei.Design and Fabrication of a Miniature Resonant Pressure Sensor Based on MEMS Technology[J].Micronanoelectronic Technology,2008,45(10). |
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| Authors: | Gao Zhenning Chen Deyong Wang Junbo Wu Zhengwei |
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| Affiliation: | Gao Zhenning1,2,Chen Deyong1,Wang Junbo1,Wu Zhengwei1(1.State Key Laboratory of Transducer Technology,Institute of Electronics,Chinese Academy of Sciences,Beijing 100190,China,2.Graduate University of Chinese Academy of Sciences,Beijing 100039,China) |
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| Abstract: | A electromagnetic actuated and detected silicon resonant pressure sensor was developed by microelectromechanical system(MEMS)technology.By using the H type doubled-supported beam as a resonator,the differential test structure was adopted for the sensor.The sensor was fabricated by bulk silicon micromachining and sealed into an evacuated package by a stress isolating mechanical structure.With an open-loop and a close-loop measuring system based on the special locked amplification technology,the parameters su... |
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| Keywords: | microelectromechanical system(MEMS) resonant pressure sensor electromagne-tic incentived and electromagnetic detected differential test bulk silicon micromachining |
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