| 高厚径比板湿制程主要失效模式及预防控制 |
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| 引用本文： | 曾红,宋祥群. 高厚径比板湿制程主要失效模式及预防控制[J]. 印制电路信息, 2012, 0(9): 24-28,52 |
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| 作者姓名： | 曾红 宋祥群 |
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| 作者单位： | 东莞生益电子有限公司,广东东莞523039 |
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| 摘 要： | 高层次、高厚径比板具有较高的附加值,现已成为我公司主要制作产品之一。文章主要是简述此类型板在我公司湿制程过程中出现的一些异于其它普通板的失效模式及其预防控制方式。
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| 关 键 词： | 高层次 高厚径比 湿制程 失效模式 预防控制 |
The prevention and control method of the major failure modes of the high aspect ratio board in the wet process |
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| ZENG Hong,SONG Xiang-qun. The prevention and control method of the major failure modes of the high aspect ratio board in the wet process[J]. Printed Circuit Information, 2012, 0(9): 24-28,52 |
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| Authors: | ZENG Hong SONG Xiang-qun |
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| Affiliation: | ZENG Hong SONG Xiang-qun |
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| Abstract: | The high level,the high aspect ratio due to the thick plate is of high added value,has now become one of our main products are made.This paper mainly described in this type of wet process the board appeared in the process of some different from other common board failure modes and their prevention and control method. |
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| Keywords: | high level high aspect ratio wet process failure modes prevention and control |
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