Microscopically-Determined Static Recrystallization of Copper During Holding Without Stress or with Stress Relaxation After Hot Working

Abstract

After deformation to 0.15 in the range 450–540°C and 1.8 × 10^?3 to 1.8 s^?l in compression or torsion, the recrystallization of ETP Cu determined microscopically is compared to the restoration measured mechanically during intervals of holding at the deformation temperature under both stress-free and stress-relaxation conditions. Recrystallization is initially much slower than softening, the difference being due to recovery, but finally they become equal at about 85%. TEM substructures sharpen considerably during intervals up to 100 s. Recovery and recrystallization occur more rapidly as strain rate and temperature rise in both modes of holding, but in stress relaxation the former is slowed down and as a result the latter is speeded up.