Three-dimensional chemo-thermomechanically coupled simulation of curing adhesives including viscoplasticity and chemical shrinkage

Based on the one-dimensional material model developed by Liebl et al. (Arch Appl Mech, 2011) a three-dimensional viscoelastic-viscoplastic material model for small deformations of curing adhesives on the basis of continuum mechanics is proposed in this contribution. The model describes the most relevant phenomena which occur during curing processes in the automotive industry and includes the effects of temperature and degree of cure on the mechanical properties of the material. Thermal expansion as well as chemical shrinkage are also contained. The yield stress for the viscoplastic part of the model goes back to the work of Schlimmer and Mahnken (Int J Numer Meth Eng 63:1461–1477, 2005), but is formulated in reference to the degree of cure and the temperature. Therefore this model considers chemo-thermomechanical coupling and extends the plasticity approach of Schlimmer and Mahnken, which is devised for cured adhesives, to the whole curing range, from the uncured to the fully cured adhesive. A peculiar focus is hereby laid on epoxy resins used in the automotive industry as structural adhesives.