| 次亚磷酸盐在化学镀液中的应用研究 |
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| 引用本文： | 吴水清. 次亚磷酸盐在化学镀液中的应用研究[J]. 表面技术, 1991, 0(5): 1-6 |
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| 作者姓名： | 吴水清 |
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| 作者单位： | 中国科学院高能物理研究所 |
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| 摘 要： | 简要地介绍次亚磷酸盐化学镀液的应用历史,探讨次亚磷酸盐的还原机制,提出了次亚磷酸盐在化学镀镍、化学镀铜、化学镀钴、化学镀锡、化学镀铅锡、化学镀金、化学镀铁、化学镀砷、化学镀铬的应用方法。在此基础上,还归纳了18种配方。文章提供的配方及其工艺参数。具有一定的参考价值。
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| 关 键 词： | 化学镀 镀镍 镀液 次亚磷酸盐 |
Researches on the Application of Hypophosphite to Electroless Solution |
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| Wu Shuiqing. Researches on the Application of Hypophosphite to Electroless Solution[J]. Surface Technology, 1991, 0(5): 1-6 |
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| Authors: | Wu Shuiqing |
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| Abstract: | This paper introduces the application history on the electroless solution of hypophosphite, probes the reducing mechanism of hypophosphite and puts forward the application method for the electroless plating of Ni, Cu, Co, Sn, Pb/Sn, Au, Fe, As, Cr. More than 18 kinds of formulas are listed here. The formulas and technological parameters provided in this paper have some reference values. |
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| Keywords: | hypophosphite electroless plating reducing mechanism electroless plating of Ni. |
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