| 无铅技术与焊膏选择 |
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| 引用本文： | 韩满林,彭琛.无铅技术与焊膏选择[J].丝网印刷,2007,6(11):7-12. |
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| 作者姓名： | 韩满林 彭琛 |
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| 摘 要： | 随着各制造企业对无铅焊料应用前景的认识以及相关立法的颁布,寻找并选择一种适当的焊膏用于生产成为当前研究的热点问题。从焊膏的主要特性参数入手,总结无铅焊料应满足的要求以及3种主要无铅焊膏合金体系的优缺点,并结合实验效果探讨如何选择适当的焊膏。
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| 关 键 词： | 无铅 焊膏 表面组装技术 |
| 修稿时间： | 2007-09-15 |
Lead-Free Technology and Solder Paste Choice |
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| Han Manlin,Peng Chen.Lead-Free Technology and Solder Paste Choice[J].Screen Printing,2007,6(11):7-12. |
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| Authors: | Han Manlin Peng Chen |
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| Abstract: | With the further cognition of the demands of lead-free solder paste and environmental legistation and regulations issuing to select a proper solder paste in production has become a focus for the manufacturers and researchers.This paper describes the main property parameters the requirements for lead-free solder paste,and the advantages and disadvantages of three main lead-free solder alloy systems.Also it specifies how to select the proper solder paste on experiments results. |
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| Keywords: | lead-free soider past SMT |
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