冷轧纯铜微观组织及织构演变的特征

介绍了电子背散射技术（EBSD）在材料织构方面的研究应用状况，并采用EBSD研究了纯铜在冷轧过程中晶粒的变化、晶粒取向及晶界角度分布的特征。结果表明，纯铜在经过大变形量后出现轧制织构，其轧制织构主要是{112}〈111〉和{011}〈112〉织构；在中小变形量下，随着变形量的增加大角度晶界逐渐减少，而到高变形量时逐渐增加。

MICROSTRUCTURE AND MICROTEXTURE EVOLUTION OF COLD ROLLING COPPER

The application of EBSD （electron back-scatter diffrantion） is reviewed in materials microtexture study. Microtexture, boundary angle distribution and orientations in high purity copper cold rolled up to 96% （thickness reduction） were investigated. It was found that some special microtexture came forth in the pure copper after cold rolled and the mainly texture were { 112} （111）and{ 110} （112）. And the area fractions of boundary high angle were decreasing with the increase of deformation at low strain , while, increased at high strain with increasing cold rolling reduction.