| 不同冷却速度对SMT焊点热循环寿命的影响 |
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| 引用本文： | 朱颖,崔殿亨.不同冷却速度对SMT焊点热循环寿命的影响[J].电子工艺技术,1996(4):12-14. |
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| 作者姓名： | 朱颖 崔殿亨 |
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| 作者单位： | [1]哈尔滨工业大学 [2]电子部十四所 |
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| 摘 要： | 采用水冷、空冷和炉冷的不同冷却方式，对焊点的热循环寿命进行了初步研究，结果表明，对ＳｎＰｂ６０／４０钎料，空冷焊点的热循环寿命最高，水冷的最差。焊点的断面均是沿晶和穿晶的混合断口，并伴有疲劳辉纹，呈现蠕变和疲劳交互作用的断裂特征。
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| 关 键 词： | 焊点 热循环 冷却速度 表面组装技术 SMT |
The effect of thermal cycling fatigue life of solder joints with different cooling rate |
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| Zhu Ying et al.The effect of thermal cycling fatigue life of solder joints with different cooling rate[J].Electronics Process Technology,1996(4):12-14. |
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| Authors: | Zhu Ying |
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| Affiliation: | Zhu Ying et al |
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| Abstract: | The thermal fatigue life of solder joints with different cooling rate has been studied.It showes that air-cooling solder joints have the longest fatigue life, while water-cooling solder joints have the shortest. Fracture surface showes creep-fatigue interaction characteristios,i.e.both intergranular crack and fatigue stripe are on it. |
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| Keywords: | Solder joint Thermal cycling Creep-fatyue |
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