| 浅谈粘结永磁材料 |
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| 引用本文： | 刘瑛.浅谈粘结永磁材料[J].电子工艺技术,1999,20(2):80-81. |
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| 作者姓名： | 刘瑛 |
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| 作者单位： | 山东省济宁市机械设计研究院,272123 |
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| 摘 要： | 介绍了粘结永磁体的趋势和现状,着重讨论了其应用领域以及未来前景,阐明了粘结永磁材料以其特有的性能,将成为新一代永磁材料。
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| 关 键 词： | 粘结永磁材料 发展历程 市场状况 |
| 修稿时间： | 1998-10-29 |
Introduce the Bond Permanent Magnets |
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| Liu Ying.Introduce the Bond Permanent Magnets[J].Electronics Process Technology,1999,20(2):80-81. |
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| Authors: | Liu Ying |
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| Abstract: | Introduce the tendency and current of the bond permanent magnets.Discuss the application and the furture.Express that the bond permanent magnets will be a newly replacement magnetic material due to its special characteristic. |
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| Keywords: | Bond permanent magnets Market situation Development and furture |
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