Korngrenzenphasen in Schmelzlötverbindungen,Bildung – Schmelzen – Zusammensetzung |
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Authors: | K. Wittke W. Scheel |
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Affiliation: | , 13086 Berlin |
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Abstract: | At the thermal solidification of metallic and non metallic melts with technical purity the thermal solidification of polycristalline substances is carried out under beginning of the corresponding grains and the beginning of a grain boundary phase between these grains. For the examination of the kinetics of melting thermally the authors used the gradual heating of eutectic SnPb solder pearls in an oxygen free heat up liquid. The developed method for the ultrasound supported dispersion of solid solder metals in an oxygen free heat up liquid was used for the separated thermal melt of the grain boundary phase and the grains. |
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Keywords: | Korngrenzenphase Schmelze thermische Erstarrung Grain boundary phase melts thermal solidification |
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