| 磨削硬质合金材料去除机理的实验研究 |
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| 引用本文： | 郭秀云,于思远.磨削硬质合金材料去除机理的实验研究[J].硬质合金,1997,14(2):99-103. |
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| 作者姓名： | 郭秀云 于思远 |
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| 作者单位： | 天津大学!天津，300072 |
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| 基金项目： | 中国工程物理研究院科学技术基金 |
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| 摘 要： | 随着硬质合金刀具材料日益广泛地应用，需要优质高效的生产合格的硬质合金刀片。本课题在干磨和湿磨条件下，分别对YG6和YT30进行了平面磨削的实验研究，并利用扫描电镜观察了在不同的磨削条件下，被磨削表面形貌、磨屑及磨削断面结构，在此基础上分析研究了硬质合金磨削过程中的材料去除机理。
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| 关 键 词： | 表面形貌 断面结构 磨屑 |
AN EXPERIMENTAL STUDY ON THE MATERIAL ROMOVAL MECHANISM OF CEMENTEDL CARBIDE |
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| Guo Xiuyun, Yu Siyuan, Wang Lixing, Chen Xirang.AN EXPERIMENTAL STUDY ON THE MATERIAL ROMOVAL MECHANISM OF CEMENTEDL CARBIDE[J].Cemented Carbide,1997,14(2):99-103. |
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| Authors: | Guo Xiuyun Yu Siyuan Wang Lixing Chen Xirang |
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| Affiliation: | Tianjin University |
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| Abstract: | Inis necessary to produce efficiently qualified carbide chip with increasing application of cemented carbide tools material,Under conditions of dry and wet grinding,experimental investigation was carride out for plane grinding of YG6 and YT30 re-spectively. The ground surface topography,sunface layer structuer and chips obstained have been observed by SEM underdifferent grinding conditions. Based on this experimental investigation the material removal mechanism of cemented carbidehas been explored in plane grinding. |
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| Keywords: | surface topography surface layer structure chip |
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