耐高温有机胶粘剂

评述了以聚酰亚胺（ Ｐ Ｉ） 、双马来酰亚胺（ Ｂ Ｍ Ｉ） 和氰酸酯为代表的耐高温有机胶粘剂的发展。 Ｐ Ｉ是目前应用最广、耐温等级最高的有机胶粘剂，它是在 Ｐ Ｉ化学和结构与性能关系的基础上解决了工艺性之后发展起来的。热塑性 Ｐ Ｉ 具有优良的韧性和粘接性能；热固性 Ｐ Ｉ则具有较好的工艺性和更高的耐温性。与 Ｐ Ｉ相比， Ｂ Ｍ Ｉ具有优良的工艺性，而且价廉，但耐温性比 Ｐ Ｉ 低。 Ｂ Ｍ Ｉ 的改性方法较多，在此基础上开发了许多 Ｂ Ｍ Ｉ 树脂。氰酸酯具有环氧树脂的工艺性，优异的介电性能和粘接性能，其中一些氰酸酯树脂可作为耐高温胶粘剂。

High Temperature Resistance Organic Adhesives

This thesis takes Polyimide( P I) , Bis maleimide( B M I) and Cyanates as representa tives to su m m arize the develop m ent of high te m perature resistant organic adhesives . Presently , P Iis an organic adhesive w hich is used m ost widelyand is resistant to tem perature reaches the highestdegree . It is developed after the problem of tech nology has been solved based on P Iche mistry andthe relation between structure and property . Ther moplastic P Ihas excellent toughness and adhesive ness. Therm oset P I has better technology andhigher resistance to tem perature . Co m pared with P I, B M Ihas outstanding technology and low cost ,but resistance to te m perature is lo wer than that of P I. There are m any ways to m odify B M I,based onthese m ethods , many kind of B M Iresin are devel oped . Cyanates has the sam e technology as epoxyresin , excellent dielectric property and adhesive ness . So me cyanates resin may be used as hightem perature resistance adhesive .