固态组件和冷板间的接触热阻实验研究

为了维护的方便,电子设备固态组件与冷板之间的连接一般不采用焊接的方式,而是采用螺钉连接、锁紧机构压紧等形式。文中对采用4个M2.5螺钉进行连接以及采用锲形块锁紧机构进行连接两种情况的接触热阻进行了对比实验研究,并研究了相同锁紧形式下,在连接界面添加不同界面材料(导热硅脂、铟箔和导热衬垫)时的接触热阻,以及不同热流密度情况下的接触热阻。结果表明:锁紧机构连接的接触热阻小于螺钉连接的情况;添加界面材料后接触热阻变小;界面材料中,添加导热硅脂时的接触热阻最小,而铟箔最大。

Experimental Study on Thermal Contact Resistance between Solid State Module and Cold Plate

For convenient maintenance, bolt connection and impaction by locking mechanism are usually used between solid state module and cold plate instead of jointing connection in electronic equipments. The thermal contact resistances of two types of connection （ connection by four M2.5 bolts and impaction by wedged-block locking mechanism） are experimentally studied by comparison in this article. The thermal contact resistances using same locking method but adding different interface material （thermal grease, indium foil and thermal conductive pad） and the thermal contact resistances under different thermal densities are also studied. Results show that the thermal contact resistance of locking mechanism connection is smaller than that of bolt connec- tion ; the thermal contact resistance is smaller when interface material are added; among the interface materi- als, the thermal contact resistance while adding thermal grease is the best and indium foil is the worst.