多层印制板金属化孔镀层缺陷成因分析及相应对策

分析了金属化孔镀层的主要缺陷及产生原因 ,从各主要工序出发 ,提出了如何优化工艺参数 ,进行严格的工艺及生产管理 ,以保证孔化质量的方法

The Analysis of the Plating Defects of Plated through Hole of the Multi-layer Printed Circuit Board and Countermeasures

This paper analyzes the main defects of the plating of plated through hole and what caused it. In order to ensure the quality of plated through hole, it gives the methods of optimizing the process parameter, strictly managing the manufacturing of the multi-layer printed circuit board.