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填充环氧树脂界面残余应力研究 Ⅴ.界面应力集中及残余应力的影响
引用本文:王洪冰,李善君.填充环氧树脂界面残余应力研究 Ⅴ.界面应力集中及残余应力的影响[J].热固性树脂,1995,10(1):5-9.
作者姓名:王洪冰  李善君
作者单位:复旦大学延生生化公司!上海200433
摘    要:本文针对橡胶和玻璃珠填充环氧树脂体系,通过显微光弹法测定填充粒子的界面应力集中系数,发现橡胶填充体系的应力集中发生在粒子赤道处,而玻璃珠体系发生在粒子两极。在低拉伸时,界面残余应力对应力集中的影响较大,但在高拉伸,特别是达到材料伸长率时,界面残余应力的作用可忽略。

关 键 词:环氧树脂  界面  残余应力  复合材料  原料  填充

STUDIES ON INTERFACIAL RESIDUAL STRESS IN FILLED EPOXY RESIN. SYSTEM V. INTERFACIAL STRESS CONCENTRATION AND EFFECT OF BUILD-UP OF INTERFACIAL RESIDUAL STRESS
Abstract:The concentration factors of the interfacial residual stress in epoxy resin systems filled with rubber or glass beans were studied with a microscopic photoelastic method. The stress concentration occured at the equator of rubber particles for the rubber-filled system and at the two poles of glass beans for the glass bean-filled system. The effect of the interfacial residual stress on the stress concentration became less with the increase of tensile elongation.
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