| Sn-Zn系无铅焊料合金的可靠性研究进展 |
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| 引用本文： | 张品,郭宏,杨福宝,徐骏. Sn-Zn系无铅焊料合金的可靠性研究进展[J]. 金属功能材料, 2007, 14(2): 41-45 |
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| 作者姓名： | 张品 郭宏 杨福宝 徐骏 |
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| 作者单位： | 北京有色金属研究总院,国家有色金属复合材料工程技术研究中心,北京,100088;北京有色金属研究总院,国家有色金属复合材料工程技术研究中心,北京,100088;北京有色金属研究总院,国家有色金属复合材料工程技术研究中心,北京,100088;北京有色金属研究总院,国家有色金属复合材料工程技术研究中心,北京,100088 |
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| 摘 要： | 环保要求和微电子器件的高度集成化驱动了高性能无铅焊料的研究和开发,近年来,Sn-Zn基无铅钎料因熔点与SnPb相近,成本低廉和机械性能优良等优点而备受关注,但是焊料的差异和焊接工艺参数的调整给焊点的可靠性带来了新的影响.本文总结了SnZn系焊料的主要失效模式,重点围绕热疲劳与机械疲劳、焊料和基体界面金属间化合物形成致裂、腐蚀等问题,阐述了SnZn系无铅焊料的可靠性,并指出提高其连接可靠性的几个途径.
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| 关 键 词： | 无铅焊料 SnZn 可靠性 失效 |
| 文章编号： | 1005-8192(2007)02-0041-05 |
| 修稿时间： | 2006-10-09 |
Progress in the Investigations on Reliability of Sn-Zn Based Lead-free Solders |
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| ZHANG Pin,GUO Hong,YANG Fu-bao,XU Jun. Progress in the Investigations on Reliability of Sn-Zn Based Lead-free Solders[J]. Metallic Functional Materials, 2007, 14(2): 41-45 |
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| Authors: | ZHANG Pin GUO Hong YANG Fu-bao XU Jun |
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| Affiliation: | National Engineering and Technology Research Center for Non-Ferrous Metals Composites, Beijing General Research Institute for Non-Ferrous Metals, Beijing 100088, China |
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| Abstract: | At present,the electronic packaging industry is actively searching for lead-free solders due to environmental concern of Pb-based solders.In particular,Sn-Zn eutectic alloy has been much expected as a candidate for a Pb-free solder material because of its low melting temperature near to SnPb,low cost and excellent mechanical properties.However,Some common reliability problems in electronic solders and new reliability problems are caused by lead-free solders.In this paper,the dominate failure modes(and the effect factors of reliabity are summarized,several ways to adcance the reliability of lead-free solder joint are put forward. |
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| Keywords: | lead-free solder SnZn reliability failure |
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