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Sn-9Zn/Cu无铅焊点ZnO须自发生长
引用本文:张亮,杨帆,郭永环,钟素娟,马佳,鲍丽.Sn-9Zn/Cu无铅焊点ZnO须自发生长[J].焊接学报,2016,37(7):1-4.
作者姓名:张亮  杨帆  郭永环  钟素娟  马佳  鲍丽
作者单位:1.江苏师范大学 机电工程学院, 徐州 221116
基金项目:国家自然科学基金项目(51475220);新型钎焊材料与技术国家重点实验室开放课题(SKLABFMT-2015-03)
摘    要:研究了Sn-9Zn/Cu无铅焊点ZnO须自发生长行为.结果表明,在室温条件下Sn-9Zn/Cu无铅焊点因为富锌相的氧化,在富锌相表面自发生长出大量的ZnO须,ZnO须呈现针状、块状、花朵状等不同形态;对ZnO须进行FIB测试,发现在富锌相中出现明显的空洞,主要是因为Zn元素扩散导致的.另外,证实在Zn元素扩散与氧发生反应的过程中,富锌相发生体积收缩,诱使结构中出现明显的拉应力,拉应力为ZnO须生长提供驱动力.

关 键 词:无铅焊点    富锌相    ZnO须    拉应力
收稿时间:2015/12/29 0:00:00

Spontaneous growth of ZnO whiskers in Sn-9Zn/Cu lead-free solder joints
ZHANG Liang,YANG Fan,GUO Yonghuan,ZHONG Sujuan,MA Jia and BAO Li.Spontaneous growth of ZnO whiskers in Sn-9Zn/Cu lead-free solder joints[J].Transactions of The China Welding Institution,2016,37(7):1-4.
Authors:ZHANG Liang  YANG Fan  GUO Yonghuan  ZHONG Sujuan  MA Jia and BAO Li
Affiliation:1.School of Mechanical & Electrical Engineering, Jiangsu Normal University, Xuzhou 221116, China2.State Key Laboratory of Advanced Brazing Filler Metals & Technology, Zhengzhou Research Institute of Mechanical Engineering, Zhengzhou 450001, China
Abstract:Spontaneous growth of ZnO whiskers in Sn-9Zn/Cu lead-free solder joints was investigated. The results indicate that due to the oxidation of rich-Zn phases at room temperature, ZnO whisker will spontaneously grow on the surface of Zn-rich phase in Sn-9Zn/Cu lead-free solder joints, and these whiskers showed different morphologies like needle-type, bulk-type and flower-type, etc. Based on FIB test of ZnO whisker, it was found that voids appeared in the Zn-rich phase, which was induced by the diffusion of Zn atoms. In addition, during reaction between Zn and O, volume shrinkage of Zn-rich phase might happen, and the tensile stress could be generated in the structure which was the driving force of ZnO whisker growth.
Keywords:lead-free solder joints  rich-Zn phases  ZnO whiskers  tensile stress
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