The electrodepositions of copper and nickel from trifluoroacetate-H2O baths

In the present study, the electrodepositions of copper from the Cu(CF₃COO)₂CF₃COOHH₂O bath and nickel from the Ni(CF₃COO)₂NH₄ClH₂O bath, were studied.In the copper electrodeposition from Cu(CF₃COO)₂ (100 g/l)CF₃COOH(0.1 N)H₂O bath, the cathode current efficiency showed about 100% and the anode current efficiency showed over 100% at low cd. In the nickel electrodeposition from Ni(CF₃COO)₂ (200 g/lH₄Cl(15.0 g/l)H₂O bath, the efficiencies of the cathode and anode were about 100%. The range of current density to obtain bright and smooth copper and nickel deposits were 4.0 ～ 24 A/dm², 5.0 ～ 16 A/dm² respectively, and the cross-section of the electrodeposits showed a granular structure.The rates of the electrodeposition of copper and nickel from the above-mentioned baths were controlled by the charge-transfer reaction in the same way as in the reaction in non-aqueous solution[1, 2].