| 室温固化厚胶层高强度环氧胶粘剂 |
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| 引用本文： | 张恩天 马麟. 室温固化厚胶层高强度环氧胶粘剂[J]. 化学与粘合, 1997, 0(4): 194-196 |
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| 作者姓名： | 张恩天 马麟 |
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| 作者单位： | 黑龙江省科学院石油化学研究所 |
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| 摘 要： | 采用环氧树脂予先与端羧基液体丁腈橡胶接枝以及合成子主链上带有多个醚键的二胺作固化剂，使调制的双组份糊状室温固化型环氧胶粘剂的甲、乙两组份均具有内增韬机制的双组份糊状室温固化型环氧胶粘剂的甲使得到的室温固化环氧胶具有极高剪切和剥离强度，并展现了厚胶层条件下仍具有高强度的特点。
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| 关 键 词： | 室温固化 环氧胶粘剂 厚胶层 高强度 胶粘剂 |
High Strength Room Temperature Curable Epoxy Resin Adhesive Under Thickening Bondline |
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| Zhang Entian,Ma Lin and Zhang Shufang. High Strength Room Temperature Curable Epoxy Resin Adhesive Under Thickening Bondline[J]. Chemistry and Adhesion, 1997, 0(4): 194-196 |
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| Authors: | Zhang Entian Ma Lin Zhang Shufang |
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| Abstract: | Using epoxy resin grafted with CTBN as part A and polyetherdiamines prepared from high temperature and pressure hydrogenation as part B,a high strength room temperature curable epoxy resin adhesive is prepared.It is obvious that the higher shear and peel strength for two part paste epoxy resin adhesive comes from the inner toughening mechanism of part A and part B especially from part B which containing three or more ether bonds in its curing agent molecules.The high toughened system leads the adhesive to keep higher shear strength under thikening bondlines. |
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| Keywords: | room temperature cure epoxy resin adhesive thickening bondline high strength |
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