Effect of small amount of rare earth addition on electromigration in eutectic SnBi solder reaction couple |
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| Authors: | Hongwen He Guangchen Xu and Fu Guo |
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| Affiliation: | (1) College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang Distinct, Beijing, 100124, China |
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| Abstract: | Effect of small amount of rare earth (RE) addition on electromigration behavior of Cu/SnBi/Cu solder reaction couple (SRC)
was investigated with current density of 5 × 103 A/cm2 at room temperature and 100 °C, respectively. Results indicate that tiny RE addition to eutectic SnBi solder alloy can make
the energy of interfaces and grain boundaries decrease, restrain the movement of dislocations and grain boundary sliding.
Therefore, phase segregation and IMC growth will be effectively suppressed which enhances the electromigration resistance. |
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