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大功率白光LED封装工艺技术与研制
引用本文:王华,耿凯鸽,赵义坤,刘亚慧.大功率白光LED封装工艺技术与研制[J].半导体技术,2009,34(5).
作者姓名:王华  耿凯鸽  赵义坤  刘亚慧
作者单位:西安卫光科技有限公司,西安,710065;西安卫光科技有限公司,西安,710065;西安卫光科技有限公司,西安,710065;西安卫光科技有限公司,西安,710065
摘    要:与传统的白炽灯、荧光灯照明相比,由于大功率白光LED具有显著的节能、环保、使用寿命长等一系列不可比拟的优势,代表着新型绿色、环保照明的发展方向,正迅速进军照明领域.从1 W大功率白光LED的封装工艺技术出发,在分析比较了几种产生白光LED方法的成本、性能的基础上,最终选取性价比相对较高的"蓝光芯片+YAG荧光粉"产生白光LED的制作方法.实践证明,在提高大功率白光LED发光效率、均匀性和稳定性等方面,还需要进一步开发新材料,采用新工艺.

关 键 词:大功率白光发光二极管  蓝光芯片+YAG荧光粉  倒装芯片技术

Research & Fabrication of Packaging Technology for High-Power White LED
Wang Hua,Geng Kaige,Zhao Yikun,Liu Yanui.Research & Fabrication of Packaging Technology for High-Power White LED[J].Semiconductor Technology,2009,34(5).
Authors:Wang Hua  Geng Kaige  Zhao Yikun  Liu Yanui
Affiliation:Xi'an Weiguang Science and Technology Co.;Ltd.;Xi'an 710065;China
Abstract:Comparing with the traditional incandescent and fluorescent lighting,the high-power white LED has many significant incomparable advantages such as energy saving,environmental protection,long life and so on.It represents the development direction of green lighting,and is moving into the field of lighting rapidly.From the packaging technology of 1 W high-power white LED,the cost and performance of several methods were analyzed and compared for white light LED.Based on this,using the "blue chip & YAG phosphor"...
Keywords:high-power white LED  blue chip & YAG phosphor  flip-flop chip technology  
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